Example Reports

Below is a selection of the type of work undertaken for the semiconductor industry

CSMA Report Titles relating to the Semiconductor Industry

XPS Analysis of Device Wafers ToFSIMS Investigation of Organic Coatings on Semi-Conductor Devices Surface Analysis of Stripped Wafers Surface Analysis of Silicon Wafers for Back Metal Contamination Surface Characterisation of Semi-Conductor Devices using Time-of-Flight SIMS Surface Analysis of Processed Wafers XPS and ToFSIMS Analysis of Staining on the Obverse Side of Silicon Wafers. DSIMS Analysis of Nitrided Silicon Oxide-Coated Wafers DSIMS Analysis of Silicon Device Wafers Depth Profiling SIMS Analysis of Two Device Areas Analysis of Surface Quality of GaAs and AlGaAs Substrates Analysis of Two Glass Coated Wafers using X-Ray Photoelectron Spectroscopy (XPS). SIMS Analysis of Surface Contaminants on Silicon Wafers DSIMS Depth Profiling of Boron, Phosphorus and Germanium in Glass Films on Silicon Substrates. DSIMS Analysis of Etched Wafers Characterisation of the Near Surface Region of Molybdenum/Silicon Multilayer Samples Using DSIMS and Angle Dependant XPS. SIMS Analysis of Competitor Device Layers DSIMS Analysis of Suspected Contamination on an InGaP Etch Wafer. DSIMS Depth Profiling of Boron in Glass Films on Silicon Substrates. Depth Profiling SIMS and Atomic Force Microscopy Analyses of Ultra-Thin Palladium Films on Silicon Wafers SIMS Analysis of Waveguides on Silicon Wafers DSIMS Analysis of De-Processed Silicon Wafers DSIMS Analysis of Sintered Titanium / Tungsten - Coated Wafers DSIMS Analysis of Phosphorus in Two Areas of a Silicon Wafer DSIMS Analysis of Silicon Dioxide Layers on Indium Phosphide SIMS Depth profile Analysis of Laser Component Facet Edges DSIMS Analysis of Metallisation Layers and Active Regions on Laser Devices DSIMS Analysis of Contamination Areas on Two Device Packages SIMS and AFM Analysis of Device Wafer and Die Samples Analysis of Surface Contaminants on Silicon Dies by DSIMS DSIMS Analysis of Metal Layers on Wafer Substrates. Surface Characterisation of Two Gallium Arsenide Wafers by ToF-SIMS SIMS Analysis of Contamination Regions on Chip and Wafer Samples Characterisation of Two Chromium Silicide Coatings on Silicon Wafers using Depth Profiling XPS, Depth profiling SIMS and X-Ray Diffraction. Characterisation of Anti-reflection Coatings on Silicon Wafers SIMS Analysis of Defect Areas on a Processed Wafer DSIMS Analysis of an Arsenic-Implanted Silicon Wafer for Metallic Impurities. SIMS Analysis of Bond Pad Areas on a Processed Device SIMS Analysis of Metallised Layers on GaAs Substrates Analysis of Silicon Wafers using ToF-SIMS ToF-SIMS Analysis of Al/V Wafers An XPS Investigation of the Surface Chemistry of Four GaAs Wafers ToF-SIMS Analysis of the Backside of Two Silicon Wafers XPS and AES Depth Profiling Studies of Metallisation Peeling Failure on Diode Array Wafers. An XPS and AES Study of Peeling Failure on Aluminium Metallised Silicon Wafers. Depth Profiling SIMS Analysis of TiN/Ti Layers on a Processed Wafer for Aluminium Contamination. Surface Analysis of Metallised Layers on GaAs Substrates Surface Analysis of a CCD Device and Two Silicon Wafers by X-ray Photoelectron Spectroscopy. DSIMS Analysis of P-well Areas for Arsenic Surface Analysis of Stain Areas on a Textured Wafer by Imaging SIMS Surface Analysis of Stained Wafer using ToF-SIMS and XPS Depth Profiling SIMS Analysis of Processed Wafers DSIMS Analysis of NiSi Coated Silicon Wafers for Copper Contamination DSIMS Analysis of Device Wafers for Ionic Contamination DSIMS Analysis of InP Wafers for Sputter Contaminants DSIMS Analysis of Device Structures. Analysis of Non-Bonding and Bonding Silicon Wafers using Angle Dependent XPS DSIMS Analysis of Silicon Wafers for Ionic Contamination An XPS Take-off-Angle Modelling Analysis of Oxide on Silicon Wafers. ToF-SIMS Investigation into the Poor Bonding Behaviour of Silicon Wafers SIMS Analysis of Phosphorus Diffusion Profiles in Silicon SIMS Analysis of Phosphorus Diffusion Profiles in Polysilicon Analysis of Aluminised Wafers using ToF-SIMS SIMS Analysis of Contamination on InP Wafers. Analysis of Silicon Wafers using ToF-SIMS Dynamic SIMS Analysis of Contaminated Wafer Areas. Analysis of Silicon Wafers using ToF-SIMS Analysis of Tungsten Coated Wafers using ToF-SIMS Analysis of Silicon Wafers using ToF-SIMS Analysis of Contamination on a Silicon Wafer using ToF-SIMS SIMS Analysis of Buried Features on Polysilicon and Silicon Oxide-Covered Wafers. Analysis of Silicon Wafers using ToF-SIMS LIMA Analysis of "Worm Contamination on IC Wafers Analysis of Bond Pad Contamination on Two Wafers using ToF-SIMS. Analysis of contamination on a TiN/W wafer using ToF-SIMS Surface Characterisation of Wafer Sections by ToF-SIMS A LIMA study of particulate contamination on an optical waveguide. Surface Analysis of Discoloured Wafer Polishing Pads using XPS An investigation into surface contamination on 6 silicon wafers using ToF-SIMS Surface Analysis of two Silicon Wafers using High Mass Resolution ToF-SIMS Surface Analysis of Failure Interface of (TiN) Multilayer Structure using XPS and Depth Profiling XPS LIMA characterisation of BPSG oxide on silicon wafers. An XPS/LIMA study of discoloured capacitors. A LIMA study of contaminant spots on a silicon wafer An AES depth profiling study of phosphorus and boron dopant distribution in IC resistors Analysis of silicon wafers using high resolution ToF SIMS Analysis of corroded bond pads on silicon devices using ToF SIMS.