Example Reports

Below is a selection of the type of work undertaken for the electronics industry

CSMA Report Titles relating to the Electronics Industry

Investigation into Variable Wire Bonding Performance on Pressure Sensor Heads using ToFSIMS Further XPS Analysis of Pressure Transducer Components XPS Analysis of Contaminated Chip Surfaces on Smart Cards Investigation into Wire Disbondment on Sensor Heads Investigation of Adhesion Failure and Blisters on Coated PCBs SEM Analysis of Gold Alloy Coated PCB Pads Analysis of Contaminated Boards Under ICs and Ribbon Cables Analysis of Gold Bond Pads using DSIMS, ToF-SIMS, Optical Microscopy and XPS Surface Analysis of a Stain on a Resistor Comparative Analysis of Dielectric Ink Layers used in Flexible Electronic Circuits DSIMS Analysis of Bond Pad Regions DSIMS Analysis of Multilayer Coating Structures Analysis of Palladium Coated Nickel Foils using DSIMS. ToF-SIMS Analysis of Gold Fingers on Printed Circuit Boards Surface Analysis of Two Copper Plates using DSIMS SIMS Analysis of Facet Edge Region on Laser Diode for Contamination Characterisation Surface Analysis of Two Copper Plates using XPS and ToF-SIMS Qualitative Comparison of Failing Connector Pins using DSIMS Investigation of the Origin of Circular Defects on a DVD Depth Profiling SIMS Analysis of Two Device Areas ToF-SIMS Investigation of Bond Pads on Good and Failed Circuit Boards Comparison of good and failed bond pads on populated circuit boards using XPS and DSIMS. Investigation of Solder Blistering Problem using ToF-SIMS and XPS Investigation into the Origin of White Spot Contamination on Printed Circuit Board Laminate. Analysis of Two Glass Coated Wafers using X-Ray Photoelectron Spectroscopy (XPS). Investigation into Crack Penetration on Impact and Vibration Tested Hybrid Circuit Packages. Investigation into the Cause of Layer Delamination in Printed Circuit Boards using ToF-SIMS and XPS. Surface Analysis of Stained Areas on LCD Backplates Characterisation of the Near Surface Region of Molybdenum/Silicon Multilayer Samples Using DSIMS and Angle Dependant XPS. Analysis of Inner Surfaces of Gold Drill Holes on Printed Circuit Boards Analysis of the Surface of Dies for Identification of Ionic Contaminants using ToFSIMS Analysis of Tarnish on Nickel/Gold Printed Circuit Panel using XPS An XPS/AES Study of Poor Wire Bond Stability on Hybrid Diode Arrays. Investigation into the Cause of the Ripple Effect on the Surface of Clear Epoxy Moulded CCD Devices. Analysis of Gold Layers on Copper/Nickel Bond Pads using DSIMS and XPS Depth Profiling Surface Analysis of a White Residue on a Circuit Board Connector using ToF-SIMS and XPS Analysis of Failed Solder Joint using XPS and DSIMS Comparison of the Metallisation Layer Structure on Voltage Pass and Fail Samples by DSIMS. SIMS Analysis of Optical Fibre Samples An XPS/AES investigation of Solder Staining on a Gold Coated Printed Circuit Board Track. SIMS Depth profile Analysis of Laser Component Facet Edges An AES Investigation into Tarnishing and Wire Bond Failure on a Hybrid Diode Array. DSIMS Analysis of Bond Pad Pull Fails DSIMS Analysis of Metallisation Layers and Active Regions on Laser Devices Analysis of White Spot Contamination on Nickel-Plated Metal Strips by ToF-SIMS and XPS DSIMS Analysis of Gold / Nickel Metallisation Layers on Copper Pads. DSIMS Analysis of Contamination Areas on Two Device Packages DSIMS Analysis of Laser Component Facet Edges An AES and DSIMS Depth Profiling Study of Gold Plated Ni:P Bond Pads for Reflow Soldering. Further Investigation into Sonar Component Delamination using ToF-SIMS Quantification of Boron Nitride Levels on Nickel Cap Samples using XPS. IR Analysis of Integrated Circuit plastic Moulding Encapsulant DSIMS Analysis of Delaminated Metal Layers and Crystalline Deposits on Die Samples. SIMS Analysis of Laser Components Surface Analysis of Two "Hybrid" Devices using X-ray Photoelectron Spectroscopy (XPS). DSIMS Analysis of Corroded areas of Device Bond Pads. Analysis of the Effect of Candidate Cleaning Procedures Upon the Long Term Stability of Brass Components Analysis of Localised Spot Contamination on a Copper Foil by XPS and ToF-SIMS. XPS Investigation of Insulation Breakdown in Tin Plated Capacitors. An Investigation into Discolouration of Copper Bond Pads on Circuit Boards using XPS. SIMS Analysis of Bond Pad Areas on a Processed Device An XPS Take off Angle Analysis of Organic Residue Thickness on Diodes. Investigation into 'White Spot' Problem and Surface Cleanliness of Circuit Boards using XPS, DSIMS and ToF-SIMS An AES Investigation of Trimetal Strip Disbondment on Diode Rim Structures. ToF-SIMS Analysis of a DVD Disc SIMS Analysis of P and N Contacts on Laser Diode Structures SIMS Imaging Analysis of Gold Contact Layers ToF-SIMS Analysis of a Failed DVD Disc SIMS Analysis of Contamination on Bond Pad Areas AES Analysis of a Defect on a Magnetic Hard Disc. Surface Analysis of Identified Areas on Printed Circuit Boards DSIMS Analysis of Tungsten CVD Layers Surface Analysis of Defect Copper Pads on a 'Silver Flashed' PCB's using ToF-SIMS and XPS An XPS Investigation of the Cause of Nickel Battery / PCB Contact Plate Problems Analysis of Flux Residues using X-ray Photoelectron Spectroscopy. DSIMS Analysis of Gold Bond Wires Analysis of Fluxes and Printed Circuit Boards using ToF-SIMS Examination of the Cause of Failure of Card Head Reader Components using Surface Analysis Techniques An XPS Investigation of Bond Pad Corrosion and Possible Contamination on IC Dies Before and After Baking DSIMS Analysis of Device Structures. Investigation of Discolouration of Polishing Pads using ToF-SIMS. Further Investigation of Discolouration of Polishing Pads using XPS Surface and Depth Profile Analysis of Bondability Problem on Raytheon Thick Film Devices using DSIMS and XPS Investigation of Discolouration of Polishing Pads using XPS Qualitative SIMS Analysis of the NiFe layer on a Head Device. Quantitative Analysis of Fe-Al-Si Alloys and Head Devices by DSIMS, XPS and EDX. An XPS Investigation of the Effects of Tamping on Gold Wire Bonding to a Circuit Board Quantitative XPS Composition Analysis of a Co-sputtered Osmium and Tungsten Film. XPS Studies of Frosting on Tinned Circuit Board Bond Pads Analysis of Corroded Bond Pads using ToF-SIMS Investigation into Hole Defects in Doped Barium Titanate Ceramics using Imaging SIMS. An XPS Investigation of Missing Nickel Pads on Surface Mount Circuit Boards Investigation of the Interface Region between Silver-impregnated Carbon Layer and Copper Pads by Dynamic SIMS A LIMA study of Frosting on Silver Pads on a Printed Circuit Board. Three-Dimensional SIMS Analysis of Void Regions on Suspect Aluminium Tracks A LIMA, XPS and DSIMS Analysis of Particulate Contamination Between Glass Plates of LCD Displays An XPS Investigation of Gold Adhesion Loss on Circuit Boards An XPS/AES analysis of paraffin wax coating on gold plated connector pins. An XPS and LIMA investigation of contamination on printed circuit boards. LIMA Analysis of Bond Pad Corrosion and Encapsulant Delamination in an Integrated Circuit Device An XPS Investigation of Discolouration of Titanium Films on Glass An Investigation into Poor Solderability on PCB Drill Holes using X-ray Photoelectron Spectroscopy (XPS) ToF-SIMS Analysis of the Gold Flash Layer on Nickel PCB Substrates An Investigation into Delamination of the Parylene Coating from a Circuit Board using Angle Dependent X-ray Photoelectron Spectroscopy An SEM Investigation of InterConnect Defects and Foil Cracking on Three Circuit Board Sets A LIMA and AES study of payphone printed circuit board contacts which exhibit high resistance after use. A Combined XPS / AES Characterisation of the Surfaces of Printed Circuit Boards After a Series of Cleaning Treatments. Surface Analysis of Tantalum Resistors using ToF-SIMS An Investigation into Micro-Cratering on Tantalum Anodes using ToF-SIMS. An Investigation into Poor Solderability to Bond Pads of a Circuit Board using X-ray Photoelectron Spectroscopy (XPS) Surface and Near Surface Analysis of Two Capacitor TaOx Films by XPS Further Investigation into Surface Contamination on Anode Surfaces AES depth profiling analysis of Pt:Si layers on LP diodes. Analysis of Contaminated Bond Pads using Time-of-Flight SIMS. Surface Analysis of Tantalum Resistors using ToF-SIMS Further Investigation into a Non-Wetting Phenomenon on Tantalum Oxide Anodes using ToF-SIMS Calibration and measurement of silver plating thickness using argon ion depth profiling AES. Analysis for the presence or otherwise of an organic contaminant on TaOx capacitors using ToF-SIMS. An XPS investigation of solder joint degradation on linear transformer windings An Investigation into Non-Wetting Resin Plugs on PCB's using ToF-SIMS. Analysis of Staining on a Printed Circuit Board using X-ray Photoelectron Spectroscopy (XPS) AES depth profiling study of silver plating thickness on copper pads. Further XPS investigations of non-wetting of manganese dioxide on tantalum anodes A combined XPS spectroscopy and imaging investigation of manganese dioxide non-wetting on tantalum anodes LIMA analysis of brown stains next to track on PCB component. LIMA analysis of coaxial cable foam and raw polymer beads AES depth profiling analysis of failed gold contact layers on strain gauges. An XPS investigation of gold delamination from contact pads on strain gauges Analysis of Contaminated PCB Section using Small Spot X-ray Photoelectron Spectroscopy (XPS). Analysis of White Deposit on PCB Section using X-ray Photoelectron Spectroscopy (XPS). Further XPS investigations of poor silvering on copper PCB pads Surface cleanliness analysis of four PCBs made with no clean solder pastes An XPS investigation of surface staining on ceramic chip capacitors Investigation into Defects in Plating Silver onto PCB Copper Pads An Investigation into Coating Failure on a Projector Lens using X-ray Photoelectron Spectroscopy (XPS). AES depth profiling analysis of Au:Al contact formation on IC bond pads Analysis of Corroded Bond Pads on Dies using Time-of-Flight SIMS Quantitative Line Profile Analysis of Phosphorus Distribution of Cross-Sections of Silica Fibres by DSIMS An AES/LIMA study of electroless Au/Ni coating failure on PCBs. An XPS investigation of brown tarnishing on silver bond pads A combined optical microscopy / XPS investigation of corrosion of chip legs on LCD display circuit boards An XPS study of failed solder joints from linear transformers LIMA studies of contamination of foam insulation in microwave cables. LIMA study of iron contamination of microwave cable An XPS/AES/LIMA study of electro-deposited gold foil print heads. An XPS/LIMA study of discoloured capacitors. An AES depth profiling study of gold coated Nickel-Phosphorus contact pads on a printed circuit board. An XPS study of manganese dioxide layers on capacitor samples LIMA study of copper cable core after soap tank treatment An AES study of palladium sulphide conductive coating on the walls of PCB drill holes An AES depth profiling study of through plated PCB contacts after modified cleaning An AES depth profiling study of through plated PCB contacts showing poor wetting behaviour. An XPS study of solder pin cleaning treatments An XPS study of contamination levels on test pieces An XPS study of stiction on micro-machined accelerometer devices An AES depth profiling study of phosphorus and boron dopant distribution in IC resistors Analysis of corroded bond pads using ToF SIMS Further surface analysis of bond pads using ToF SIMS Analysis of silver coated copper bond pads using depth profiling XPS Analysis of corroded bond pads using ToF SIMS.