Failure/Disbondments of Components to Bond Pads

When devices fail it can often be down to the disbondment of one bond. If this bond can be identified techniques such as XPS and SIMS profiling can be utilised to determine if the cause.

The cause is often down to poor cleaning of the bond pads leaving an invisible contaminant behind which can cause problems when the bonds are adhering to the pads. If this contaminant can be identified it can be eradicated from the process.